国際会議 IEEE ISMICT 2026が大阪公立大学 文化交流センター@大阪で開催され，村松研からは下記の発表を行いました．

M. Kodama, D. Muramatsu, “Coupler-Skin Interfacial Buffer Effects on SAR-Limited Received Power in Capacitive Coupling WPT for Implantable Devices”, The 20th IEEE International Symposium on Medical Information and Communication Technology (ISMICT 2026), Osaka Japan, Sep. 2026.

Y. Sasaki, D. Muramatsu, “Backscatter Communication for ICM Using Combined Split-Ring Resonator and On-Body Ring”, The 20th IEEE International Symposium on Medical Information and Communication Technology (ISMICT 2026), Osaka Japan, Sep. 2026.