PUBLICATION

原著論文

  1. K. Yamamoto, Y. Nishida, K. Sasaki, D. Muramatsu, F. Koshiji, “Electromagnetic Field Analysis of Signal Transmission Path and Electrode Contact Conditions in Human Body Communication”, Applied Sciences, Vol.8, No.9, pp1-12, 2018.

国際会議

  1. D. Muramatsu, K. Sasaki, “LED Control System Using Human Body Communication Between Two Users”, The 2018 ACM International Joint Conference on Pervasive and Ubiquitous Computing (UBICOMP 2018) and The 22nd International Symposium on Wearable Computers (ISWC 2018), pp.408-411, Singapore, Oct. 2018.
  2. D. Muramatsu, N. Kanamori, T. Yamamoto, “Evaluation of Blood Phantom for Non-invasive Blood Glucose Measurement Based on Bioelectromagnetic Response”, The 40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2018), pp. 348, Hawaii, USA, Jul. 2018.
  3. F. Koshiji, R. Urushidate, D. Muramatsu, T. Yamamoto, K. Koshiji, “Real-time Heartbeat Signal Sensing and Transmission Using Human Body Communication”, The 40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2018), pp.294, Hawaii, USA, Jul. 2018.
  4. K. Koshiji, F. Koshiji, Y. Fujita, D. Muramatsu, T. Yamamoto, “Transmission Characteristics Enhancement of Magnetically-Coupled Body Area Network Using Parasitic Wearable Coil”, The 40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2018), pp.295, Hawaii, USA, Jul. 2018.
  5. Y. Nishida, K. Sasaki, K. Yamamoto, D. Muramatsu, F. Koshiji, “Transmitter-Receiver Distance and Equivalent Output Impedance in Human Body Communication”, IEEE Wireless Communications and Networking Conference 2018 (WCNC 2018), pp.1160-1161, Barcelona, Spain, Apr. 2018.

国内会議

  1. 西田欣史, 佐々木健, 山本健太郎, 村松大陸, 越地福朗, “人体通信における送信機電極面積と受信機側から見た等価回路”, 電子情報通信学会2018年ソサイエティ大会, B-20-21, pp.445, 金沢, 2018年9月
  2. 山本健太郎, 西田欣史, 村松大陸, 越地福朗, 佐々木健, “人体通信における電極接触条件と伝送特性の電磁界解析”, 2018年度精密工学会春季大会, pp.853-854, 文京区, 2018年3月
  3. 西田欣史, 佐々木健, 村松大陸, 越地福朗, “人体通信における送信機電極間隔が伝送特性に及ぼす影響と等価回路モデル”, 第32回エレクトロニクス実装学会春季講演大会論文集, pp.118-121, 野田, 2018年3月